Electronic device housing with integrated antenna

ABSTRACT

An electronic device may include a display, a housing member at least partially surrounding the display and including a first segment defining a first portion of an exterior surface of the electronic device, a second segment defining a second portion of the exterior surface of the electronic device and configured to function as an antenna, and a bridge segment structurally and conductively coupling the first segment to the second segment. The electronic device may also include a molded element positioned between the first segment and the second segment and defining a third portion of the exterior surface of the electronic device.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation patent application of U.S. patentapplication Ser. No. 16/183,591, filed Nov. 7, 2018 and titled“Electronic Device Housing with Integrated Antenna,” which is anonprovisional patent application of and claims the benefit of U.S.Provisional Patent Application No. 62/725,227, filed Aug. 30, 2018 andtitled “Electronic Device Housing with Integrated Antenna,” thedisclosures of which are hereby incorporated herein by reference intheir entireties.

FIELD

The described embodiments relate generally to electronic devicehousings, and more particularly to housings that include integratedantennas.

BACKGROUND

Electronic devices often use wireless communications to send and receiveinformation. Tablet computers, mobile telephones, and notebookcomputers, for example, all use wireless radios to send and receiveinformation. In some cases, a device may use multiple different antennasto facilitate wireless communications in different frequency bands.Antennas may be positioned inside of an electronic device housing andmay send and receive wireless signals (e.g., electromagnetic waves)through the device housing.

SUMMARY

An electronic device may include a display, a housing member at leastpartially surrounding the display and including a first segment defininga first portion of an exterior surface of the electronic device, asecond segment defining a second portion of the exterior surface of theelectronic device and configured to function as an antenna, and a bridgesegment structurally and conductively coupling the first segment to thesecond segment. The electronic device may also include a molded elementpositioned between the first segment and the second segment and defininga third portion of the exterior surface of the electronic device.

The first segment, the second segment, and the bridge segment may beformed from a single piece of metal. The first segment, the secondsegment, and the bridge segment may include a conductive material, andthe molded element may be a non-conductive polymer material. The firstsegment may define a back wall of the electronic device and the secondsegment may define a side wall of the electronic device. The moldedelement may at least partially encapsulate the bridge segment.

The electronic device may further include antenna circuitry coupled tothe second segment and configured to process signals corresponding to awireless communication protocol. A length of the second segment maycorrespond to a wavelength of the wireless communication protocol.

An electronic device may include a display, a cover assembly defining atleast a portion of a front surface of the electronic device, a touchsensor configured to detect touch inputs applied to the front surface ofthe electronic device, and a housing member at least partially enclosingthe display and the touch sensor. The housing member may include a firstsegment defining a first portion of a back surface of the electronicdevice, and a second segment coupled to the first segment and defining asecond portion of the back surface of the electronic device and a recessformed along an interior side of the second segment. the Recess may beconfigured to tune capacitive coupling between the first segment and thesecond segment. The electronic device may also include a molded elementpositioned between the first segment and the second segment and defininga third portion of the back surface of the electronic device, andantenna circuitry coupled to the second segment. The second segment maybe set apart from the first segment by a slot, and the molded elementmay be positioned in the slot.

The second segment may define a ledge extending into an internal volumeof the electronic device, the recess may be one of a series of recessesformed in the ledge, the ledge may define at least a portion of amounting surface, and the cover assembly may be attached to the mountingsurface. The series of recesses may extend along an entire length of thesecond segment.

The molded element may be a first molded element and the electronicdevice may further include additional molded elements within therecesses of the series of recesses. The additional molded elements maydefine an additional portion of the mounting surface.

The recess may define an interlock feature, the electronic device mayfurther include an additional molded element positioned within therecess and engaged with the interlock feature, and the engagementbetween the additional molded element and the interlock feature mayconstrain movement of the additional molded element in multipledirections.

An electronic device may include a display, a cover over the display anddefining at least a portion of a front surface of the electronic device,and a conductive housing member defining at least a portion of a backwall opposite the front surface. The conductive housing member mayinclude a first segment defining a first portion of the back wall of theelectronic device and a second portion of the back wall extending alonga slot formed in the housing member and having a reduced thicknessrelative to the first portion the back wall. The conductive housingmember may also include a second segment configured to function as anantenna, defining a third portion of the back wall, and a fourth portionof the back wall extending along the slot and having a reduced thicknessrelative to the third portion of the back wall. The electronic devicemay further include a molded element positioned in the slot and defininga fifth portion of the back wall.

The slot may be formed in the back wall, the slot may define a length ofthe second segment, and the length of the second segment may correspondto a wavelength of a wireless communication frequency of the antenna.The second portion of the back wall may define a first beveled edge, thefourth portion of the back wall may define a second beveled edge, andthe first and second beveled edges tune a capacitive coupling betweenthe first segment and the second segment.

The conductive housing member may be a single piece of aluminum, and thefirst segment and the second segment may be connected by a bridgesegment defined by the single piece of aluminum. The first segment mayfurther define a first portion of a side wall of the electronic device,the second segment may further define a second portion of the side wall,and the molded element further defines a third portion of the side wallbetween the first segment and the second segment.

The second segment may defines a ledge extending into an internal volumeof the electronic device, the ledge may define a series of recessesconfigured to tune a capacitive coupling between the second segment andthe display, the ledge may define at least a portion of a mountingsurface, and the cover is attached to the mounting surface.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A depicts a front view of an example electronic device;

FIG. 1B depicts a back view of the electronic device of FIG. 1A;

FIG. 1C depicts an exploded view of the electronic device of FIG. 1A;

FIGS. 1D-1E depict partial views of the electronic device of FIG. 1A;

FIG. 2A depicts a front view of an example housing for an electronicdevice;

FIG. 2B depicts a back view of the housing of FIG. 2A;

FIG. 3 depicts a portion of a housing for an electronic device;

FIG. 4 depicts a partial cross-sectional view of the housing of FIG. 3;

FIGS. 5A-5C depict partial cross-sectional views of example housings foran electronic device;

FIG. 6 depicts a partial cross-sectional view of an example housing foran electronic device;

FIG. 7A depicts a portion of a housing for an electronic device;

FIG. 7B depicts a partial cross-sectional view of the housing of FIG.7A;

FIG. 7C depicts a portion of a housing member for an electronic device;

FIGS. 7D-7E depict partial cross-sectional views of the housing of FIG.7C;

FIG. 8 depicts a portion of a housing member for an electronic device;

FIG. 9 depicts a partial cross-sectional view of a housing for anelectronic device;

FIGS. 10A-10B depict example housings for electronic devices; and

FIG. 11 depicts a schematic diagram of an example electronic device.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following description is not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

In conventional portable electronic devices, antennas may be positionedinside of a housing. For example, in the case of a mobile phone (e.g., asmartphone) that includes a housing and a transparent cover, an antennamay be positioned in an internal cavity defined by the housing and thecover. The antenna may send and receive wireless signals (e.g.,radio-frequency (RF) electromagnetic signals) through the material ofthe housing and/or the cover. In order to avoid or reduce attenuation ofthe incoming and outgoing signals, the housing and/or cover may beformed from substantially non-conductive materials, such as plastic.

In some cases, it is desirable to use other housing materials. Forexample, a metal housing may be stronger, tougher, easier tomanufacture, or the like. However, housings that include or are formedfrom metals (or other conductive materials such as carbon fiber) mayhave a shielding effect on internal antennas that reduces theirefficiency and/or effectiveness. Accordingly, as described herein, wherehousings include conductive materials such as metals, a portion of thehousing itself may be used as an antenna to send and/or receive RFsignals. More particularly, a metal or conductive housing may includestructures that serve as both structural portions of the housing, suchas a side wall, as well as RF radiating and/or receiving components. Inorder to function as antennas, these structures may need to be separatedfrom other conductive portions of the housing while still beingstructurally joined to the other conductive portions of the housing.

As described herein, antenna structures of a device may be integral withthe housing (or a portion of the housing). For example, a single pieceof metal may be machined or otherwise formed to include antennastructures from the same piece of metal as a main body of the housing.In some cases, the antenna structures may even define structuralportions of the housing, such as a side wall that defines an exteriorsurface of the housing. For example, the integral antenna structures maybe formed by machining a slot (e.g., an elongated channel-like opening)in a housing member. The slot may form a beam-like cantilevered memberthat extends from a main portion of the housing member. FIGS. 2A-2Billustrate how slots in a housing member may define antenna structures.

A material may be positioned in the gap to seal the gap and tostructurally support the antenna structures. The housing and the antennastructures may also include interlock features, such as holes,dovetails, recesses, protrusions, or the like, that are engaged by thefiller material to help keep the filler material in place and to improvethe overall structural strength of the housing and its antennastructures.

Because an integrated antenna structure may be close to other metal orconductive portions of the housing, the antenna structure maycapacitively couple to the nearby housing (or other conductivecomponents of the device, such as a display or a circuit board), thusdegrading or otherwise negatively affecting the performance of theantenna. Accordingly, the antenna structures and/or the housingsdescribed herein may include features that decrease the capacitivecoupling between an antenna structure and an adjacent portion of thehousing (as compared to antenna structures and/or housings that do notinclude such features). Such features may help tune the capacitivecoupling (e.g., may cause the antenna features to experience capacitivecoupling that is below a threshold level) without requiring drasticincreases in separation distance between the antenna and the housing orotherwise weakening the overall structure. For example, an antennastructure and a nearby portion of a housing may have chamfers, roundededges, recesses, or other features or shapes that effectively removematerial from the portions of the antenna and housing that are closestto one another. This may ultimately tune the capacitive coupling betweenthese components, and/or between an antenna structure and any otherconductive or potentially interfering component proximate to the antennastructure.

As used herein, features that tune the capacitive coupling between anantenna structure and another component may cause the antenna structuresto experience capacitive coupling that is at or below a threshold level,or that is otherwise reduced relative to the same (or similar) antennastructure without the features. The threshold level of capacitivecoupling may be a level below which suitable antenna functionality maynot be achieved. For example, the threshold level of capacitive couplingmay the level at which an antenna cannot reasonably operate inaccordance with a target wireless communication protocol. Wirelesscommunication protocols may include established protocols such as IEEE802.11x, GSM, LTE, CDMA, TDMA, Bluetooth, Bluetooth Low Energy, ISO/IEC18000-3, or any other target wireless communication protocol or standard(including yet-to-be-developed protocols and/or standards). Further, thethreshold level of capacitance may specify an antenna efficiency of theantenna (e.g., an electrical efficiency with which a radio antennaconverts the radio-frequency power accepted at its terminals intoradiated power) while the antenna is communicating via a wirelesscommunication protocol or standard. For example, in some cases thethreshold level of capacitive coupling may be that which allows theantenna to operate according to a wireless communication protocol whileachieving a target antenna efficiency.

While the features that provide mechanical interlocks and that reducedeleterious capacitive coupling are described in some cases herein inthe context of an integrated housing and antenna structure (e.g., asingle piece of material), similar features, structures, and techniquesmay be used for multi-part housing and antenna structures as well. Forexample, where an antenna structure is a separate piece of metal than ahousing feature (as shown, for example, in FIGS. 10A-10B), theinterlocks and capacitance-reducing features described herein may beused to provide similar benefits.

FIGS. 1A-1B depict an electronic device. In this example, the electronicdevice 100 includes a housing member that is formed of a single piece ofa conductive material (e.g., metal), and in which antennas are formeddirectly into the single-piece housing member. The electronic device 100is depicted as a tablet computer, though this is merely one exampleembodiment of an electronic device and the concepts discussed herein mayapply equally or by analogy to other electronic devices, includingmobile phones (e.g., smartphones), watches (e.g., smartwatches),wearable electronic devices, notebook computers, desktop computers,health-monitoring devices, head-mounted displays, digital media players(e.g., mp3 players), or the like.

The electronic device 100 includes an enclosure, which may include ahousing 102 and a transparent cover 106 (also referred to simply as acover) coupled to the housing 102. The cover 106 may define a front faceof the electronic device 100. For example, in some cases, the cover 106defines substantially the entire front face and/or front surface of theelectronic device. The cover 106 may also define an input surface of thedevice 100. For example, as described herein, the device 100 may includetouch and/or force sensors that detect inputs applied to the cover 106.The cover 106 may be formed from or include glass, sapphire, a polymer,a dielectric, a laminate, a composite, or any other suitable material(s)or combinations thereof.

The cover 106 may cover at least part of a display 107 that ispositioned at least partially within the housing 102 (FIG. 1B). Thedisplay 107 may define an output region in which graphical outputs aredisplayed. Graphical outputs may include graphical user interfaces, userinterface elements (e.g., buttons, sliders, etc.), text, lists,photographs, videos, or the like. The display 107 may include aliquid-crystal display (LCD), organic light emitting diode display(OLED), or any other suitable components or display technology.

The display 107 may include or be associated with touch sensors and/orforce sensors that extend along the output region of the display andwhich may use any suitable sensing elements and/or sensing techniques.Using touch sensors, the device 100 may detect touch inputs applied tothe cover 106, including detecting locations of touch inputs, motions oftouch inputs (e.g., the speed, direction, or other parameters of agesture applied to the cover 106), or the like. Using force sensors, thedevice 100 may detect amounts or magnitudes of force associated withtouch events applied to the cover 106. The touch and/or force sensorsmay detect various types of user inputs to control or modify theoperation of the device, including taps, swipes, multi-finger inputs,single- or multi-finger touch gestures, presses, and the like. Touchand/or force sensors usable with wearable electronic devices, such asthe device 100, are described herein with respect to FIG. 11.

The housing 102 of the device 100 may include molded elements 104 (e.g.,104-1, 104-2) that are positioned in gaps, spaces, slots, or other areasbetween portions of a housing member 101. The molded elements 104 maydefine, along with the housing member 101, portions of the exteriorsurface of the device 100. The housing member 101 may be formed from orinclude a conductive material, such as metal (e.g., aluminum, steel,stainless steel, titanium, amorphous alloy, magnesium, or other metal oralloy), carbon fiber, or the like. The molded elements 104 may be formedfrom or include a polymer material, a reinforced polymer material (e.g.,fiber reinforced), ceramic, or any other suitable material. The moldedelements 104 may be formed of a substantially non-conductive and/orelectrically insulating material, or otherwise configured toelectrically (e.g., conductively and/or capacitively) isolate orinsulate portions of the housing member 101 from each other, asdescribed in greater detail herein. In some cases, the molded elements104 may be formed by injection molding a material into a gap, space,slot, or other void defined in the housing member 101.

As described herein, the housing member 101 may include segments thatform antennas for the electronic device. For example, the housing member101 may include beams, cantilevered members, or other features that areseparated (at least partially) from a main portion of the housing memberby gaps, slots, or spaces. The molded elements 104 may be positioned inthose gaps, slots, or spaces to fill the gaps and to strengthen theantenna structures and the housing 102 as a whole. FIGS. 2A-2Billustrate an example housing with slots in which the molded elements104 may be positioned.

FIG. 1B depicts a back view of the device 100. FIG. 1B more clearlyillustrates an example configuration of the housing member 101 and themolded elements 104. The housing member 101 may define a first segment110, which may define a first portion of an exterior surface of theelectronic device. For example, the first segment 110 may define atleast a portion of a back surface (and a back wall) of the electronicdevice. In some cases, the first segment 110 defines substantially allof the back surface of the electronic device, such as more than about80%, more than about 90%, or more than about 95% of the back surface ofthe electronic device. As more clearly shown in FIGS. 2A-2B, the firstsegment 110 may also define at least a portion of a side wall of thedevice 100 (e.g., the lateral side walls of the device), and in somecases can define portions of multiple side walls of the device (e.g.,part of a top side wall and part of a left side wall, as shown in FIG.2A).

The housing member 101 may also define second segments 112 (e.g., 112-1,. . . , 112-n). The second segments 112 may also define part of theexterior surface(s) of the device 100. For example, the second segments112 may define a portion of the back surface of the device 100, as wellas a portion of the side surfaces of the device 100. In some cases, thesecond segments 112 define at least a portion of a side wall (e.g., thetop and bottom side walls) of the device 100, and at least a portion ofthe back wall of the device 100. FIGS. 5A-5C depict cross-sectionalviews showing how a second segment may define at least a portion of aback wall and at least a portion of a side wall of a device.

The second segments 112 may also define corners of the device 100. Forexample, the second segment 112-2 (FIG. 1C) defines a portion of a firstside wall 126 of the device 100, and a portion of a second side wall 128of the device 100. Other second segments 112 of the device may similarlydefine portions of at least two side walls of the device 100, as shownin the figures.

As described herein, the second segments 112 may be integral with thefirst segment 110. Stated another way, the housing member 101 may be asingle, monolithic component, and the first segment 110 and the secondsegments 112 may be parts of the single, monolithic component. One ormore of the second segments 112 may be configured to function as anantenna for the device 100.

The molded elements 104, which are positioned in the spaces or gapsbetween the first segment 110 and the second segments 112, may alsodefine part of the exterior surface of the electronic device. Forexample, the first segment 110, one or more of the second segments 112,and one or more of the molded elements 104 may define a singlecontinuous exterior surface of the device. In some cases, the singlecontinuous surface may be a back surface 114 of the device 100, or aside surface 118. The single continuous surface defined by these threecomponents may be (or may appear to a user to be) substantially smoothand/or seamless. For example, the interface between adjacent componentsmay be sufficiently smooth or tight that a user cannot tactilelyperceive or feel any gaps, crevices, grooves, dips, bumps, or othersurface irregularities when handling the device.

The shapes, sizes, locations, or other dimensions or properties of thesecond segments 112 may be selected based on several factors. Where asecond segment 112 (or a portion thereof) is configured to be an antennastructure (e.g., a structure that sends and/or receives wirelesscommunication signals), it may have a length that corresponds to awavelength of a wireless communication protocol. In some cases, thelength of the second segment 112 (or the portion configured as anantenna structure) may be equal to the wavelength of the frequency bandof the wireless communication protocol (e.g., a full-wave antenna). Inother cases, it may correspond to a fraction or harmonic frequency ofthe frequency band. For example, the length may be one half of thewavelength (e.g., a half-wave antenna), or one quarter of the wavelength(e.g., a quarter-wave antenna), or any other suitable length thatfacilitates communication over the desired frequency band. The wirelesscommunication protocol may use a frequency band around 2.4 GHz, 5 GHz,15 GHz, 800 MHz, 1.9 GHz, or any other suitable frequency band. As usedherein, a frequency band may include frequencies at the nominalfrequency of the frequency band, as well as additional frequenciesaround the nominal frequency. For example, an antenna structure that isconfigured to communicate using a 2.4 GHz frequency band may receiveand/or radiate signals of in a range from about 2.4000 GHz to about2.4835 GHz (or in any other suitable range). Other frequency bands mayalso encompass a range of nearby frequencies, and an antenna configuredcommunicate via those frequency bands may be capable of radiating andreceiving frequencies within those ranges as well.

The length of a second segment 112 may correspond to a length of thesegment from a base (where the second segment joins the remainder of thehousing member 101) to an end of the segment (e.g., a terminal end thatis separated from the remainder of the housing member 101). A secondsegment 112 that is configured to operate as an antenna may be coupledto antenna circuitry that is configured to process signals correspondingto the wireless communication protocol. Example antenna circuitry mayinclude processors, inductors, capacitors, oscillators, signalgenerators, amplifiers, or the like.

FIG. 1C depicts an exploded view of the device 100 of FIG. 1A, showingthe cover 106 removed from the housing 102. A display 107 may bepositioned below the cover 106 and within the housing 102. The display107 may include various display components, such as liquid crystaldisplay (LCD) components, light source(s) (e.g., light emitting diodes(LEDs), organic LEDs (OLEDs)), filter layers, polarizers, lightdiffusers, covers (e.g., glass or plastic cover sheets), and the like.The display 107 may be integrated with (or the device 100 may otherwiseinclude) touch and/or force sensors. Using touch sensors, the device 100may detect touch inputs applied to the cover 106, including detectinglocations of touch inputs, motions of touch inputs (e.g., the speed,direction, or other parameters of a gesture applied to the cover 106),or the like. Using force sensors, the device 100 may detect amounts ormagnitudes of force associated with touch events applied to the cover106. The force sensors may be configured to produce an electricalresponse that corresponds to an amount of force applied to the cover106. The electrical response may increase continuously as the amount ofapplied force increases, and as such may provide non-binary forcesensing. Accordingly, the force sensor may determine, based on theelectrical response of the force sensing components, one or moreproperties of the applied force associated with a touch input. The touchand/or force sensors may detect various types of user inputs to controlor modify the operation of the device, including taps, swipes,multi-finger inputs, single- or multi-finger touch gestures, presses,and the like.

The device 100 may also include internal components 109. The internalcomponents 109, shown as a block for clarity, may include any suitablecomponent of a device, including processors, memory, haptic actuators,electrical circuitry, circuit boards, imaging devices, cameras,batteries, input devices, radios, communications circuitry, lightsources, etc. The internal components 109 may be positioned in aninternal volume of the electronic device, which may be defined at leastpartially by the housing 102 (which may form a cavity defined by a backwall and side walls of the housing 102) and the cover 106.

FIG. 1D depicts a partial view of the housing 102, corresponding to afirst corner of the housing 102 (e.g., the upper-left corner of thehousing 102, as oriented in FIG. 1B). FIG. 1D illustrates how a secondsegment 112 (e.g., the second segment 112-2) may be electricallyconnected to antenna circuitry to receive and/or send wirelesscommunication signals. For example, antenna circuitry may be connectedto the second segment 112-2 at a first connection point 120 and a secondconnection point 122. In some cases, the first connection point 120 iscoupled to an electrical ground, and the second connection point 122 iscoupled to an antenna feed (e.g., a source of an electromagnetic signalthat transmits wireless signals to the second segment 112-2, and/or acircuit that receives and/or analyzes an electromagnetic signal receivedby the second segment 112-2). A conductive path 129 may be definedbetween the connection points 120, 122, corresponding to the conductivepath corresponding to an electromagnetic component of a transmitted orreceived wireless communication signal.

As noted above, the molded element 104-1 may be formed from a dielectricmaterial, such as a polymer, fiber-reinforced polymer, multiplepolymers, or the like. The molded element 104-1 may electrically isolatethe second segment 112-2 from the first segment 110, at least along alength of the second segment 112-2. Accordingly, the molded element104-1 helps define the conductive path 129 and isolate the conducivepath 129 to the second segment 112-2, thus allowing the second segment112-2 to function as an antenna.

FIG. 1D also shows another second segment 112-5 that may operate as anantenna. For example, similar to the discussion above with respect tothe second segment 112-2, antenna circuitry may be connected to thesecond segment 112-5 at a first connection point 130 and a secondconnection point 132. In some cases, the first connection point 130 iscoupled to an electrical ground, and the second connection point 132 iscoupled to an antenna feed (e.g., a source of an electromagnetic signalthat transmits wireless signals to the second segment 112-5, and/or acircuit that receives and/or analyzes an electromagnetic signal receivedby the second segment 112-5). A conductive path 133 may be definedbetween the connection points 130, 132, corresponding to the conductivepath corresponding to an electromagnetic component of a transmitted orreceived wireless communication signal.

FIG. 1D shows an example configuration for two of the second segments112 defined by the housing member 101. Similar configurations may beemployed for other second segments 112 of the housing member 101 toallow those second segments 112 to function as antennas. In some cases,the lengths of the second segments 112 (and/or the length of the slotsthat at least partially define the second segments 112) may be differentfrom one another, or may otherwise be configured to communicate usingdifferent frequencies, frequency bands, wireless communicationprotocols, or the like. For example, the second segment 112-2 shown inFIG. 1D may be configured to operate on a 2.4 GHz and 5 GHz frequencyband, while another second segment 112 (e.g., the second segment 112-1,FIG. 1C) may be configured to operate on an 800 MHz frequency band(including a suitable range of nearby frequencies, as described above).In some cases, one second segment 112 may operate on multiple frequencybands, while another second segment 112 may operate on a singlefrequency band. In this way, different wireless communication functionsmay be provided by different second segments 112. For example, onesecond segment 112 may be configured as a WiFi antenna, while adifferent second segment is configured as a cellular antenna (e.g., tocommunicate with telecommunications providers via cellulartelecommunications networks).

FIG. 1E depicts another partial view of the housing 102, correspondingto a second corner of the housing 102 (e.g., the upper-right corner ofthe housing 102, as oriented in FIG. 1B). FIG. 1E illustrates how thesecond segment 112-1 may be electrically connected to antenna circuitryto receive and/or send wireless communication signals. For example,antenna circuitry may be connected to the second segment 112-1 at afirst connection point 134 and a second connection point 135. In somecases, the first connection point 134 is coupled to an electricalground, and the second connection point 135 is coupled to an antennafeed (e.g., a source of an electromagnetic signal that transmitswireless signals to the second segment 112-1, and/or a circuit thatreceives and/or analyzes an electromagnetic signal received by thesecond segment 112-1). A conductive path 136 may be defined between theconnection points 134, 135, corresponding to the conductive pathcorresponding to an electromagnetic component of a transmitted orreceived wireless communication signal.

As noted above, different second segments 112 may be configured tocommunicate via different frequency bands and/or different wirelesscommunication protocols. For example, each of the second segments 112-1,112-2, and 112-5, shown in FIGS. 1D-1E, may act as antennas, and may beconfigured to communicate via different frequency bands and/or wirelesscommunication protocols.

FIG. 2A depicts a front view of the housing member 101, with theinternal components of the device 100 as well as the molded elements 104removed. FIG. 2A shows the monolithic construction of the housing member101. In particular, the housing member 101 defines the first segment 110and the second segments 112 (e.g., 112-1-112-4). The housing member 101also defines bridge segments 202 (e.g., 202-1, . . . , 202-n) thatstructurally couple the second segments 112 to the first segment 110.While FIG. 2A shows bridge segments 202-1 and 202-2 coupling the secondsegments 112-1 and 112-2, respectively, to the first segment 110, itwill be understood that similar bridge segments may couple the secondsegments 112-3 and 112-4 to the first segment 110. The bridge segments202 may be at least partially covered and/or encapsulated by a moldedelement 104, as shown and described herein.

The bridge segments 202 may also conductively couple the second segments112 to the first segment 110. For example, where the housing member 101is a single piece of metal, the bridge segments 202 may bothstructurally and conductively couple the second segments 112 to thefirst segment 110 due to the fact that all of the segments are formed ofa single metal structure. In other cases, the first segment 110 and thesecond segments 112 may be separate components, and they may bestructurally and conductively coupled to one another via a separatebridge segment. In such cases, the bridge segments may be attached tothe first and second segments via welds, fasteners, rivets, stakes,adhesives, interlocks, or any other suitable mechanism or technique.

The housing member 101 may define or include slots 204. The slots 204may define the second segments 112, and set the second segments 112apart from the first segment 110 (at least along a length of the slot).For example, the slots 204 may define segments of the housing member 101that are at least partially separated from the rest of the housingmember 101 (e.g., the first segment 110). As shown in FIG. 2A, the slots204 may be defined through various walls of the housing member 101. Forexample, the slot 204-3 forms an opening in a side wall 206 of thehousing member 101 as well as a back wall 208 of the housing member 101.Further, the slots 204 may define the length of a second segment 112,which may correspond to and/or define the particular wirelesscommunication protocol with which the second segment 112 is configuredto communicate. For example, the length of a second segment 112 (whichmay establish the frequency at which it resonates) may equate to thelength of the slot that defines the second segment 112, or it may equateto the length of the second segment that is defined by the slot.

FIG. 2B depicts a back view of the housing member 101. As shown in FIG.2A, the second segments 112 (e.g., 112-1-112-6) are coupled to the firstsegment 110 via the bridge segments 202 (e.g., 202-1-202-4). Notably,though the bridge segments 202 connect the first segment 110 to thesecond segments 112, blind recesses 210 are formed into the housingmember 101 along the bridge segments 202. One more blind recesses 210may connect several slots (which are formed completely through thehousing member 101) to form a single, continuous opening along the backand side walls of the device 100. Once a continuous opening is filled bya molded element (e.g., the molded element 104-1, FIG. 1B), the moldedelement may extend over the bridge segments 202-1, 202-2 in a continuousunbroken line (e.g., filling the blind recesses 210 that extend over thebridge segments 202-1, 202-2). Accordingly, the bridge segments 202 maynot be visible from the outside of the device, and each of the moldedelements 104 may appear to be continuous, unbroken members.

FIG. 3 depicts a partial view of the housing 102, showing the housingmember 101 with a molded element positioned in the slots that define thesecond segments 112-1 and 112-2. As noted above, the second segments 112(or portions thereof) of the housing member 101 may be used as antennastructures. FIG. 3 illustrates several features of the housing 102 thatfacilitate the antenna functionality of the second segments, and thatfacilitate a secure engagement between the molded element(s) and thehousing member 101.

As shown in FIG. 3, the housing member 101 includes the second segments112-1, 112-2, and 112-5 which are defined by slots formed in the housingmember 101. The slots are occupied by the molded element 104-1.

The second segment 112-2 may define a first antenna structure 302, andthe second segment 112-5 may define a second antenna structure 303, andthe second segment 112-1 may define a third antenna structure 304, witheach antenna structure defined by a slot. For example, the first antennastructure 302 is defined at least in part by the slot 204-3, the secondantenna structure 303 by the slot 204-2, and the third antenna structure304 by a portion the slot 204-1.

As noted above, a conductor that acts as an antenna may be negativelyaffected by nearby conductive materials. For example, capacitivecoupling between the first antenna structure 302 and the portion of thehousing member 101 that is across the slot 204-3 from the first antennastructure 302 (e.g., the first segment 110) may reduce the effectivenessof the first antenna structure 302. In order to tune the capacitivecoupling between the first antenna structure 302 and the housing member101, the second segment 112-2 may define one or more recesses 305 on aninterior side of the second segment 112-2 (e.g., a recess that isconfigured to be within the internal volume of the device 100 when thedevice is assembled). The interior side of the second segment 112-2 maybe opposite an exterior side of the second segment 112-2, where theexterior side of the second segment 112-2 defines an exterior surface ofthe device 100. The recesses 305 may be positioned along a ledge of thesecond segment 112-2, as shown in greater detail in FIG. 4. As shown inFIG. 3, multiple recesses 305 defining a series of recesses 305 may bedefined by the second segment 112-2 along the slot 204-2. The series ofrecesses 305 may extend along substantially an entire length of the slot(and/or the entire length of the portion of the second segment 112-2that extends along the slot). Other antenna structures (e.g., theantenna structures 303, 304) may include similar recesses 305, as shownin FIG. 3.

The recesses 305 may tune the capacitive coupling between the secondsegment 112-2 and the first segment 110 of the housing member 101 byincreasing the distance between the second segment 112-2 and the firstsegment 110 (at least in the area where the recess is formed), orbetween the second segment 112-2 and any conductive component of thedevice that is proximate to (e.g., directly across from) the recesses305 and which may capacitively couple to the second segment 112-2. Moreparticularly, capacitive coupling between two conductors may bedecreased by increasing the distance between the two conductors. Byforming the recesses 305 in the second segment 112-2, as shown in FIG.3, a greater amount of the second segment 112-2 is positioned furtheraway from the first segment 110 and/or another internal conductivecomponent than would be the case if the recesses 305 were not included.Stated another way, the recesses may increase the average distancebetween the second segment 112-2 and the first segment 110 (or betweenthe second segment 112-2 and another conductive material or component,such as a display). Accordingly, capacitive coupling between the secondsegment 112-2 and another component may be lower than if the recesses305 were not included. More specifically, in some cases the secondsegment 112-2 may define a surface that faces towards or is otherwisenear a surface of another conductive material. The recesses 305 may beformed along or in the surface of the second segment 112-2 to increasethe distance between the surfaces, thereby reducing capacitive coupling.The recesses 305 may be empty, or they may be filled by a moldablematerial, which may be the same moldable material as that which occupiesthe slots (e.g., the slot 204-2).

The first segment 110 may also include recesses 308. The recesses 308may also serve to tune the capacitive coupling between the antennastructures and the first segment 110 (e.g., to reduce the capacitivecoupling relative to a segment without the recesses 308). Additionally,the recesses 308 may function as retention features that engage a moldedelement that is positioned in a slot (e.g., the molded element 104-1).In particular, the recesses 308 may define an undercut that prevents themolded element from separating from the recess 308. More particularly,as shown in FIG. 4, the recesses 308 may be pill- or lozenge-shapedrecesses with an opening that is narrower than the width or widestdimension of the recess 308, which may also be referred to as anundercut or undercut feature. Thus, once the molded material isintroduced into the recesses 308 (and cured or otherwise hardened), themolded material is captured in the recesses 308 and is thus secured tothe first segment 110 (at least along some directions). Of course, othershapes for the recesses 308 are also contemplated, such as dovetails,triangles, or the like.

While features in FIG. 3 are described with reference to the firstantenna structure 302 and the slot 204-2, it will be understood thatsimilar features may be applied to other portions of the housing member101 as well. For example, FIG. 3 also depicts recesses 305 and 308positioned along the slot 204-1.

FIG. 3 also shows an example of another feature that may provideinterlock functionality as well as some additional function. Inparticular, the housing member 101 (and in particular the first segment110) includes boss features 310. The boss features 310 may take the formof posts that extend from the first segment 110. The boss features 310may be cylindrical, square, or any other suitable shape, and may bethreaded or otherwise configured to receive a fastener or othercomponent. A molded element (e.g., the molded element 104-1) maysurround, partially surround, or otherwise engage with the boss features310 such that the molded element is secured to the boss features 310. Inaddition to forming structures for the molded element to structurallyengage, the boss features 310 may provide other functions as well. Forexample, an internal component of a device may be attached to thehousing member 101 via the boss features 310. For example, a circuitboard, antenna, camera module, battery, sensor, grounding conductor, orthe like, may be secured to the housing member 101 using a fastener thatengages a boss feature.

FIG. 4 depicts a detail view of the housing member 101. In particular,FIG. 4 shows a portion of the second segment 112-2 that includesrecesses 305. As shown, the recesses 305 may be formed in a ledge 402that extends into an internal volume of the electronic device. Therecesses 305 may be at least partially filled or otherwise occupied byanother material 400. In some cases, the material 400 filling therecesses 305 may be the same material as the molded element that ispositioned in the slot between the first segment 110 and the secondsegment 112-2. In some cases, the recesses 305 are filled during thesame molding process that fills the slots that define the antennastructures of the device. For example, the housing member 101 may beinserted into a mold of a molding machine, and a moldable material maybe injected into the mold such that the material flows into one or moreslots, into the recesses 305, as well as into and/or around one or moreadditional features, retention structures, recesses, bosses, dovetails,holes, or the like. This process may be generally referred to asinjection molding or insert molding. After the molding process iscomplete, the housing member 101 with the moldable material may bemachined or otherwise processed to form the final shape of the housing102. The machining process may separate portions of the moldablematerial into discrete components or pieces. For example, in some cases,after the moldable material is applied to the housing member 101, thematerial in the recesses 305 is contiguous with the moldable element104-1 (which may be formed from a moldable material such as a polymer)that is positioned in the slot 204-2 (FIG. 2A). After machining, thematerial in the recesses 305 may be separated from the material in theslots.

As shown in FIG. 4, the recesses 305 may be configured to retain thematerial 400 in the recesses 305. For example, the recesses 305 mayinclude chamfer features 404, 406, and the material 400 may engage thechamfer features 404, 406 to constrain the material 400 in the recesses305, thereby preventing it from coming out of or separating from therecesses 305. More particularly, the engagement between the material 400and the chamfer feature 406 may prevent the material 400 from coming outof or separating from the recess 305 in an upward direction (relative tothe orientation shown in FIG. 4), while the chamfer feature 404 mayprevent the material 400 from coming out of the recess 305 in a downwarddirection. Further, the recesses 305 may have a narrowed region along afront face 408 of the ledge 402 that prevents the material 400 fromcoming out of the recess 305 in a direction that is parallel to theledge 402 (e.g., parallel with a mounting surface 410 defined by theledge 402).

As described above, the recesses 305 may be configured to tune thecapacitive coupling between an antenna structure (e.g., the firstantenna structure 302 defined by the second segment 112-2) and anotherportion of the device (e.g., the first segment 110, a display, aninternal frame, or the like). FIG. 4 illustrates how the currentcorresponding to a received or transmitted electromagnetic signal may beconfined to a path 412 that is further towards the exterior surface ofthe second segment 112-2 (thus placing the path 412 further away fromother metal components, such as the first segment 110, that maycapacitively couple to the second segment 112-2 and interfere withantenna performance). If the recesses 305 were not included, and theledge 402 was instead a solid, continuous metal segment, the path 412may be oriented closer to the face 408 of the ledge 402 than shown inFIG. 4, which may serve to increase the deleterious effects of othermetal or conductive components of the housing (e.g., by decreasing thedistance between the current path and the other conductive components).

FIG. 4 also shows additional features that may be formed in or otherwisedefined by the housing member 101. For example, the housing member 101may include through-holes 414 and retention holes 416. The through-holes414 and the retention holes 416 are shown as being located in the secondsegment 112-2, though the same or similar features may be located at anyother suitable location of the housing member 101.

The through-holes 414 may be configured to provide access through thehousing member 101 for devices that require or benefit from exposure tothe outside environment. For example, the through-holes 414 may bepositioned proximate to a speaker or other audio output device to allowsound to be directed outside of the housing 102. The through-holes 414may also provide environmental access (e.g., access to the externalenvironment surrounding the device) to other components, such asmicrophones, pressure sensors, temperature sensors, or componentsthereof.

The retention holes 416 may be configured to receive moldable materialto provide strength and rigidity to the overall housing structure. Forexample, as described in greater detail with respect to FIG. 5A, theretention holes 416 may be angled or otherwise configured to prevent thesecond segment 112-2 from being separated, broken, or bent away from thefirst segment 110 when a separating force is applied between the firstsegment 110 and the second segment 112-2. FIG. 4 omits the moldedelement 104-1 for clarity, though it will be understood that the moldedelement 104-1 may completely or partially occupy the retention holes416.

FIGS. 5A-5C depict partial cross-sectional views of electronic devicehousings, showing additional details of housing members and moldedelements that may be implemented in various housing configurations. Forexample, FIG. 5A, which is a partial cross-section of the housing 102,viewed along line B-B in FIG. 4, shows an example configuration of theretention holes 416. As shown, the retention hole 416 communicates witha slot (e.g., the slot 204-3) in which the molded element 104-1 ispositioned. The retention hole 416 is angled relative to a horizontalaxis (relative to the orientation shown in FIG. 5A). This angle may helpincrease the strength of the second segment 112-2 relative to the firstsegment 110. For example, the engagement between the molded element104-1 and the angled retention hole 416 may help prevent the secondsegment 112-2 from being pulled away from the first segment 110. Bycontrast, a retention hole that is not angled (e.g., a horizontal hole)may not provide as much resistance to a separating force. In some cases,the retention holes 416 may also tune the capacitive coupling between asecond segment 112-2 and the first segment 110 by increasing the averagedistance between the second segment 112-2 and the first segment 110, ina manner similar to the recesses 305 described above.

FIG. 5A also illustrates another feature of the housing member 101 thathelps tune the capacitive coupling between different portions of thehousing member 101 (e.g., between the second segment 112-2, which mayoperate as an antenna, and the first segment 110). In particular, theslot 204-3 may be between the first segment 110 and the second segment112-2, and may define the length, width, and/or other dimension orconfiguration of the second segment 112-2 itself. The slot 204-3, and inparticular the walls defining the slot, may have a reduced thicknessproximate the opening of the slot 204-3, which may reduce capacitivecoupling between the first segment 110 and the second segment 112-2(relative to walls without a reduced thickness region).

For example, as shown in FIG. 5A, the first segment 110 may define afirst portion 502 of a back wall 208 of a housing 102, where the firstportion 502 has a first thickness. The first segment 110 may also definea second portion 504 of the back wall 208, where the second portion 504extends along the slot 204-3 and has a reduced thickness relative to thefirst portion 502 of the back wall 208. Similarly, the second segment112-2 may define a third portion 506 of the back wall, where the thirdportion 506 has a third thickness, and may also define a fourth portion508 of the back wall, where the fourth portion 508 has a reducedthickness relative to the third portion 506. As shown, the portions 504,508 (also referred to as reduced thickness portions 504, 508) aredefined by beveled edges 511 formed into the housing member 101 alongthe first segment 110 and the second segment 112-2. In otherimplementations, the reduced thickness portions may be defined by othershapes (e.g., a rabbet, a cove, or the like).

By reducing the thickness of the first segment 110 and the secondsegment 112-2 where the first and second segments 110, 112-2 are closetogether (e.g., along the slot 204-3), the amount or degree ofcapacitive coupling between the first segment 110 and the second segment112-2 may be reduced, as compared to a configuration where the segmentsdo not have a reduced thickness. As described above, this configurationmay provide better antenna performance in cases where the second segment112-2 operates as an antenna. More particularly, by reducing the facingarea of the conductive materials that face one another across the slot204-3, capacitive coupling between the two conductive materials (herethe first segment 110 and the second segment 112-2) may be reduced. Insome cases, the reduced thickness portions 504, 508 extend the fulllength of the slot 204-3 (including any linear sections, curvedsections, or the like). In some cases, each slot in a housing memberthat defines an antenna portion may include reduced thickness portionsalong the length of the slot (e.g., the full length of the slot).

FIG. 5A also depicts how the ledge 402 and the molded material 400cooperate to define the mounting surface 410. The mounting surface 410may receive and/or support another component or assembly of a device.For example, a cover assembly (which may include the cover 106 andoptionally one or more components of a display, touch sensor, forcesensor, or the like) may be positioned on the mounting surface 410. Insome cases, the cover assembly (or any other suitable component) may beadhered to the mounting surface 410. In such cases, an adhesive (e.g., aheat-sensitive adhesive, pressure-sensitive adhesive, liquid adhesive,etc.) may be placed on the mounting surface 410 and/or the coverassembly, and the cover assembly may be placed on and bonded to themounting surface 410. A cover assembly may instead or additionally besecured to the housing 102 via fasteners, clips, latches, mechanicalinterlocking structures, or any other suitable features or materials.

FIG. 5B is a partial cross-sectional view of another housing 510. FIG.5B may represent a cross-section of the housing 102 at a differentlocation than that shown in FIG. 5A (e.g., line C-C in FIG. 4), or itmay represent a cross-section of a different housing. The housing 510includes a first segment 512 (which may be an embodiment of or otherwisesimilar to the first segment 110) and a second segment 513 (which may bean embodiment of or otherwise similar to the second segment 112-2). Thefirst and second segments 512, 513 may define a slot 519 that separatesthe first segment 512 and the second segment 513 at least along thelength of the slot 519. The housing 510 may also include a ledge 518 onwhich a component (e.g., a cover assembly) may be supported and/oradhered. As shown, the ledge 518 may be defined (at least at thelocation corresponding to the cross-section in FIG. 5B) by only thematerial of the second segment 513. Accordingly, there may be norecesses that are filled with molded material. The outermost face of theledge 518 may be extend towards the interior volume of the device lessthan the outermost face of the ledge 402 (FIG. 4). In this way,capacitive coupling between the ledge 518 and other components within anelectronic device may be tuned to achieve a target antenna performance,efficiency, resonant frequency, or the like.

The first and second segments 512, 513 may also define wall portionshaving reduced thickness 514, 516, respectively. The reduced thicknessportions 514, 516 may provide similar functionality to the reducedthickness portions 504, 508 discussed with respect to FIG. 5A. Thehousing 510 also includes a molded element 517 positioned in the slot519. The molded element may correspond to any of the molded elementsdescribed herein, and as such details of the molded element will not berepeated here. The molded element 517 may have a different configuration(e.g., size, thickness) than the molded element shown in FIG. 5A.Further, the first and second segments 512, 513 do not include retentionfeatures such as the blind holes 416 (at least at the locationcorresponding to the cross-section in FIG. 5B), and the molded element517 therefore does not have corresponding features engaged with theretention features. Of course, retention features such as undercuts,threaded holes, blind holes (e.g., the blind holes 416), or the like maybe located at other locations of the housing 510.

FIG. 5C is a partial cross-sectional view of another housing 520. FIG.5C may represent a cross-section of the housing 102 at a differentlocation than that shown in FIG. 5A (e.g., line C-C in FIG. 4), or itmay represent a cross-section of a different housing. The housing 520includes a first segment 522 (which may be an embodiment of or otherwisesimilar to the first segment 110) and a second segment 523 (which may bean embodiment of or otherwise similar to the second segment 112-2). Thefirst and second segments 522, 523 may define a slot 529 that separatesthe first segment 522 and the second segment 523 at least along thelength of the slot 529. The housing 520 may also include a ledge 528 onwhich a component (e.g., a cover assembly) may be supported and/oradhered. As shown, the ledge 528 may be defined (at least at thelocation corresponding to the cross-section in FIG. 5C) by only thematerial of the second segment 523. Accordingly, there may be norecesses that are filled with molded material. The outermost face of theledge 528 may be extend towards the interior volume of the device lessthan the outermost face of the ledge 402 (FIG. 4). In this way,capacitive coupling between the ledge 528 and other components within anelectronic device may be tuned to achieve a target antenna performance.

The first and second segments 522, 523 may also define wall portionshaving reduced thickness 524, 526, respectively. The reduced thicknessportions 524, 526 may provide similar functionality to the reducedthickness portions 504, 508 discussed with respect to FIG. 5A. Thehousing 520 also includes a molded element 527 positioned in the slot529. The molded element may correspond to any of the molded elementsdescribed herein, and as such details of the molded element will not berepeated here.

The housing 520 shows alternative retention features that may beincluded in a housing member to increase the strength, rigidity,toughness, or other structural property of the housing 520, and/or toincrease the strength of the attachment of the molded element 527 to thehousing member that defines the first and second segments 522, 523. Forexample, the second segment 523 may define a blind hole 521. The blindhole 521 may be angled relative to a horizontal axis (relative to theorientation of FIG. 5C). Accordingly, the blind hole 521 may functionsimilar to the blind holes 416 described above. In contrast to the blindholes 416, however, the blind hole 521 may extend at a different anglethan the blind holes 416. For example, it may extend at a downward anglerelative to the horizontal axis.

The first segment 522 also includes a retention feature 525. Theretention feature 525 may be formed into the first segment 522 via anysuitable process, such as machining, forging, etching, attaching aseparate member to the first segment 522, or the like. The retentionfeature 525 may extend from a surrounding surface or portion of thefirst segment 522, and the molded element 527 may at least partiallysurround, encapsulate, or otherwise engage the retention feature 525.The engagement between the molded element 527 and the retention feature525 may increase the strength, rigidity, toughness, or other structuralproperty of the housing 520, and/or to increase the strength of theattachment of the molded element 527 to the first and segment 522. Theretention feature 525 may be a post, such as a cylindrical post, squarepost, or any other shaped post. In some cases, the retention feature 525may have threads, grooves, splines, or other features that facilitatesecure engagement between the retention feature 525 and the moldedelement 527. Other types of retention features may be used on the firstsegment 522 in addition to or instead of the retention feature 525, suchas dovetails, holes, recesses, channels, undercuts, or the like.

FIG. 6 is a partial cross-sectional view of the housing 102, viewedalong line A-A in FIG. 3, which extends through the bridge segment202-2. FIG. 6 illustrates how the first segment 110 and the secondsegments may be connected together by a bridge segment (e.g., the bridgesegment 202-2 that joins the second segment 112-2 to the first segment110). As noted above, the housing member 101 may be a single piece ofmetal. Accordingly, the bridge segment 202-2, the second segments 112-2,112-5 (FIG. 3), and the first segment 110 may be a single, unbrokenpiece of metal (or any other suitable material). In some cases, the slotor slots that separate the first segment 110 of the housing from one ormore second segments continues through the bridge segment 202-2. Forexample, though a molded element may appear unbroken along a back wallof the housing, the slots in which the molded element is positioned donot completely sever the first segment 110 from the second segments.Rather, a blind recess 602 may be formed in the bridge segment 202-2 (aswell as other bridge segments shown and described herein), such that themolded element 104-1 is a single, continuous member. The blind recess602 may communicate with and essentially join the slot 204-1 and theslot 204-2. By forming the blind recess 602 through the bridge segment202-2, the molded element 104-1 may be stronger and less likely todecouple from the housing member 101 due to the added structuralintegrity resulting from the unitary structure (as opposed to havingsmaller, discontinuous molded elements separating the first segment 110from the second segments 112-2, 112-5, and the like). Moreover, themolded element 104-1 may at least partially encapsulate the bridgesegment 202-2. For example, the molded element 104-1 may be molded inthe blind recess 602 and around at least some of the sides of the bridgesegment 202-2, and optionally over the interior-facing side of thebridge segment 202-2. This may further strengthen the coupling betweenthe molded element 104-1 and the bridge segment 202-2.

The blind recess 602 may have a similar shape as an adjoining slot(e.g., the slot 204-2 and/or the slot 204-3). For example, the openingof the blind recess 602 along the back surface 114 of the housing may bethe same width as an adjacent portion of a slot 204 (which may have aconstant or variable width along the length of the slot). This mayproduce a molded element with a uniform width dimension, as shown inFIGS. 1A-1C. Further, the blind recess 602 may be defined by wallportions that have reduced thicknesses, such as the beveled edgesdescribed with respect to FIGS. 5A-5C. In some cases, the blind recess602 in the bridge segment 202-2 may be formed by the same tool(s) and/ormachining operation(s) that are used to form the slots 204. For example,a slot may be formed by machining a substantially rectangular grooveinto the wall portions of a housing member 101, and then machining thebeveled edges into the wall portions to define the reduced thicknessportions. In some cases, a tool for forming the beveled edges may belarger than the opening of the initial rectangular channel in onedimension, and smaller than the opening in another dimension. Forexample, the tool may be have a rectangular shape that can only beinserted into the channel when it is in one orientation (e.g., its longaxis is parallel to the length of the channel). In such cases, the toolmay be aligned so it's long axis is parallel to the channel, insertedinto the channel, and then rotated to machine away material in thechannel and form the reduced thickness portions (e.g., the bevelededges).

FIG. 7A is a partial view of the housing 102, showing the boss features310 of the housing member 101, and how the molded element 104-1 engagesthe boss features 310. As shown, the boss features 310 each include anopening 702 within a post or other feature that extends above a surfaceof the first segment 110. The openings 702 may be threaded, or otherwiseconfigured to receive a fastener.

In some cases, the boss features 310 extend from an interior surface ofthe back wall of the device. The molded element 104-1 may at leastpartially surround the boss features 310, and in some cases completelysurround at least an outer circumference or perimeter of the bossfeatures 310 (as shown), thereby securing the molded element 104-1 tothe first segment 110 of the housing member 101. More particularly, byat least partially surrounding the boss features 310, the molded element104-1 helps prevent the molded element 104-1 from decoupling from thefirst segment 110 at least in the direction that is parallel to the backwall 208 (FIG. 2A) of the housing 102.

FIG. 7B is a partial cross-sectional view of the housing 102, viewedalong line D-D in FIG. 7A. As shown, the boss features 310 extend abovean inner surface 704 of the first segment 110 by a height 706. Becausethe boss features 310 extend above the inner surface 704, the moldedelement 104-1 is able to at least partially surround or otherwise engagethe boss features 310 to provide the structural coupling describedabove. Further, as noted above, by extending above the inner surface704, the boss features 310 may help tune the capacitive coupling betweena component that is fastened to the housing 102 via the boss features310, and the back wall of the housing 102. For example, if the topsurfaces 708 of the boss features 310 were flush with the inner surface704 of the first segment 110, a component that is fastened to thehousing via the boss features 310 may be essentially flush with ortouching the first segment 110. This may produce deleterious capacitivecoupling between the component and the first segment 110. Because theboss features 310 are raised above the inner surface 704, the distancebetween the component coupled via the boss features 310 and the firstsegment 110 may be increased, which may tune the capacitive couplingbetween those components.

FIG. 7A also shows the area in which the slot 204-2 extends through theside wall 206 of the housing member 101. As described above, the moldedelement 104-1 may occupy some or all of an opening 705 in the side wall206, and the molded element 104-1 itself may define part of the sidesurface of the housing 102 (e.g., forming a continuous side surfacealong with the side walls defined by the second segment(s) and/or thebridge segment(s). The opening 705 may be a portion of or a feature of aslot in the housing member 101 that defines the second segment 112-5(e.g., the slot 204-2).

The second segments 112-5 and/or the side walls (which may be defined bya second segment and/or a bridge segment) may also define interlockfeatures proximate the opening 705. The molded element 104-1 may engagethe interlock features to help strengthen the housing 102 in the area ofthe slot 204-2, which may be susceptible to being pried apart orcompressed together due to use and/or misuse of the device. Theinterlock features may include openings, recesses, posts, undercuts,holes, threaded or grooved features, or any other suitable feature withwhich the molded element 104-1 may engage to help retain the moldedelement 104-1 to the housing member 101.

FIG. 7C depicts a portion of the housing member 101 that includes theopening 705, showing the housing without the molded element 104-1 andrevealing example interlock features. As shown, the second segment112-5, which may be at least partially separated from the first segment110 by the slot 204-2, includes a shelf feature 710 that defines anopening 712. Similarly, a corresponding interlock may define an opening716. As illustrated in greater detail in FIGS. 7D-7E, the molded element104-1 may fill the openings 712, 716 and surround the shelf feature 710.As described herein, the interlocking engagement between the moldedelement 104-1 and the openings 712, 716 secures the molded element 104-1to the housing member 101 and increases the strength of the housing 102.

FIG. 7D depicts a partial cross-sectional view of the housing 102,viewed along line E-E in FIG. 7A. FIG. 7D shows the shelf feature 710and the opening 712 in the shelf feature 710, and how the molded element104-1 engages the shelf feature 710 and opening 712.

FIG. 7E depicts a partial cross-sectional view of the housing 102,viewed along line F-F in FIG. 7A. FIG. 7E shows the opening 716, and howthe molded element 104-1 engages the shelf feature opening 716. Asdescribed above, the bridge segment 202-1 may include a blind recess 602(FIG. 6) that connects the slot 204-1 to the slot 204-2 (FIG. 2A) andallows the molded element 104-1 to form a continuous, unbroken memberalong the back wall 208 of the housing 102 (FIG. 2A). As shown in FIG.7E, the opening 716 may extend from a top surface 718 of the interlockfeature to a surface 720 that defines part of the blind recess 602.

As noted above, capacitive coupling between a segment of a housingmember 101 that is used as an antenna and other segments of the housingmay negatively impact the effectiveness, efficiency, or otheroperational property of the antenna. Accordingly, various features areused to tune the capacitive coupling between such segments of a housingmember 101. FIG. 8 illustrates another feature of the housing member 101that decreases the capacitive coupling between an antenna structure andanother segment of the housing member 101. In particular, FIG. 8 showsthe first segment 110 and the second segment 112-2 where the slot 204-3is formed in the housing member 101.

The slot 204-3 may extend through both the back wall 208 of the housingmember 101, as well as through a side wall 206 of the housing member.The slot 204-3 may define an opening 802 in the side wall 206 of thehousing member 101. Where the second segment 112-2 acts as an antenna,the proximity of the first segment 110 to an end face 804 of the secondsegment 112-2 may cause capacitive coupling between the end face 804 andthe first segment 110. In order to help tune the capacitive couplingbetween the first segment 110 and the end face 804 of the second segment112-2, a recess 806 may be formed in the end face 804. The recess 806may be a blind recess, and may be any suitable depth. For example, therecess 806 may have a depth (measured from the end face 804, forexample) of about 0.5 mm, about 0.75 mm, about 1.0 mm, about 1.25 mm,about 1.5 mm, about 2.0 mm, or any other suitable depth. In some cases,the recess may have a depth of about 5.0 mm or greater. In some cases,the recessed area of the end face 804 may be characterized by apercentage of the overall area of the end face 804 (e.g., the surfacearea of the end face 804 if the end face 804 had no recess). In somecase, the recessed area is equal to or greater than about 50%, about60%, about 70%, about 80%, about 90% or about 95% of the overall area ofthe end face 804. By recessing a significant portion of the end face804, the amount of the end face 804 that is in close proximity to thefirst segment 110 may be reduced thus reducing capacitive couplingbetween the second segment 112-2 and the first segment 110.

FIG. 8 also shows an example interlock feature 808 formed in the portionof the first segment 110 that defines a side of the opening 802. Theinterlock feature 808 may include a shelf feature 812 that defines anopening 814, as well as an opening 815 in the housing member 101. Themolded element 104-1 may engage the shelf features 812 and the openings814 in a similar manner to the shelf feature 710 described with respectto FIGS. 7C and 7D.

In some cases, the second segment 112-2 defines a threaded hole 816proximate the opening 802. Instead of the molded element 104-1 fillingthe threaded hole 816, the molded element 104-1 may define acorresponding through-hole that is aligned with the threaded hole 816. Athreaded fastener may be used to secure the molded element 104-1 to thesecond segment 112-2, as shown in greater detail with respect to FIG. 9.

FIG. 9 depicts an example cross-sectional view of the housing 102,viewed along line G-G in FIG. 8. While FIG. 8 shows only the housingmember 101, however, FIG. 9 also depicts the molded element 104-1 with athrough-hole 902, and a threaded fastener 904 extending through thethrough-hole 902 and engaged with the threaded hole 816 in the secondsegment 112-2. The fastener 904 may include a head 906, and the moldedelement 104-1 may be captured between the head 906 and the secondsegment 112-2. The force applied by the head 906, which compresses themolded element 104-1 between the head 906 and the second segment 112-2,retains the molded element 104-1 to the second segment 112-2 (and thehousing member 101 more generally).

In other cases, the second segment 112-2 defines interlock features withwhich the molded element 104-1 engages, similar to other retentionfeatures described herein. For example, the second segment 112-2 maydefine holes, recesses, threaded holes, posts, protrusions, undercuts,angled holes, or any other suitable interlock feature, and the moldedelement 104-1 may engage those engagement features by at least partiallyfilling, at least partially surrounding, or otherwise engaging and/orinterlocking with the interlock features to help retain the moldedelement 104-1 to the housing member 101.

The features and concepts described herein may be implemented in devicehousings that have antenna structures formed in a monolithic housingmember, such as the housing member 101. The features and concepts mayalso be implemented in device housings in which multiple discretecomponents are joined together to define the housing, such as in thehousings shown in FIGS. 10A-10B.

FIG. 10A depicts an example housing 1000 for an electronic device (e.g.,a tablet computer). The housing 1000 may be similar in overall shape asthe housing member 101 described herein, except the second segments 1002are separate components from the first segment 1004. The second segments1002 may be secured to the first segment via a molded element (which maybe the same as or similar to the molded elements 104 described herein).In some cases, the first segment 1004 and the second segments 1002include interlock and/or retention features with which the moldedelement engages to retain the second segments 1002 to the first segment1004. As noted above, the molded element may be substantiallynonconductive, and may electrically isolate the first segment 1004 fromthe second segments 1002, while also mechanically joining or retainingthe second segments 1002 to the first segment 1004. All or some of thesecond segments 1002 may be used as antennas for a device, and the firstand/or second segments 1004, 1002 may include features that tune acapacitive coupling between the segments. For example, the first segment1004 and/or any of the second segments 1002 may include recesses such asthe recesses 305 and/or the recess 806, described herein.

FIG. 10B depicts an example housing 1010 for an electronic device (e.g.,a tablet computer). Whereas the housing 1000 includes a first segment1004 that defines a back wall of a device (and, along with the secondsegments 1002, define side walls of the device), the housing 1010 may bea frame that substantially only defines side walls of a device. The backand front walls may be defined by other members or components that arecoupled to the housing 1010, such as transparent covers (e.g., glass,plastic, sapphire, polycarbonate, etc.), plates (formed of metal,plastic, composite, and/or other materials), or the like. In some cases,both a front and back wall may be defined by a transparent cover, andeither or both of the front and back wall may have an underlying display(e.g., a touch- and/or force-sensitive display, or a display without asensor).

The housing 1010 may include segments 1012 that may be secured togethervia one or more molded elements (which may be the same as or similar tothe molded elements 104 described herein). In some cases, the segments1012 include interlock and/or retention features with which the moldedelement(s) engage to retain the segments 1012 together. As noted above,the molded element may be substantially nonconductive, and mayelectrically isolate adjacent segments 1012 from one another, while alsomechanically joining or retaining adjacent segments 1012 to one another.All or some of the segments 1012 may be used as antennas for a device,and the segments 1012 may include features that tune the capacitivecoupling between the segments, or between a given segment 1012 andanother component of a device (e.g., another housing member, astructural frame, an internal circuit or other electrical component, orthe like). For example, any of the segments 1012 may include recessessuch as the recesses 305 and/or the recess 806, described herein.

FIG. 11 depicts an example schematic diagram of an electronic device1100. By way of example, the device 1100 of FIG. 11 may correspond tothe electronic device 100 shown in FIGS. 1A-1D (or any other electronicdevice described herein). To the extent that multiple functionalities,operations, and structures are disclosed as being part of, incorporatedinto, or performed by the device 1100, it should be understood thatvarious embodiments may omit any or all such described functionalities,operations, and structures. Thus, different embodiments of the device1100 may have some, none, or all of the various capabilities,apparatuses, physical features, modes, and operating parametersdiscussed herein.

The device 1100 includes one or more processing units 1101 that areconfigured to access a memory 1102 having instructions stored thereon.The instructions or computer programs may be configured to perform oneor more of the operations or functions described with respect to thedevice 1100. For example, the instructions may be configured to controlor coordinate the operation of one or more displays 1108, one or moretouch sensors 1103, one or more force sensors 1105, one or morecommunication channels 1104, one or more cameras 1111, one or moresensors 1112, and/or one or more haptic feedback devices 1106.

The processing units 1101 of FIG. 11 may be implemented as anyelectronic device capable of processing, receiving, or transmitting dataor instructions. For example, the processing units 1101 may include oneor more of: a microprocessor, a central processing unit (CPU), anapplication-specific integrated circuit (ASIC), a digital signalprocessor (DSP), or combinations of such devices. As described herein,the term “processor” is meant to encompass a single processor orprocessing unit, multiple processors, multiple processing units, orother suitably configured computing element or elements.

The memory 1102 can store electronic data that can be used by the device1100. For example, a memory can store electrical data or content suchas, for example, audio and video files, images, documents andapplications, device settings and user preferences, timing and controlsignals or data for the various modules, data structures or databases,and so on. The memory 1102 can be configured as any type of memory. Byway of example only, the memory can be implemented as random accessmemory, read-only memory, Flash memory, removable memory, or other typesof storage elements, or combinations of such devices.

The touch sensors 1103 may be configured to determine a location of atouch on a touch-sensitive surface of the device 1100 (e.g., an inputsurface defined by the cover 106). The touch sensors 1103 may use anysuitable components and may rely on any suitable phenomena to detectphysical inputs. For example, the touch sensors 1103 may use or includecapacitive sensors, resistive sensors, surface acoustic wave sensors,piezoelectric sensors, strain gauges, or the like. The touch sensors1103 may include any suitable components for detecting touch-basedinputs and generating signals or data that are able to be accessed usingprocessor instructions, including electrodes (e.g., electrode layers),physical components (e.g., substrates, spacing layers, structuralsupports, compressible elements, etc.) processors, circuitry, firmware,and the like. In some cases the touch sensors 1103 associated with atouch-sensitive surface of the device 1100 may include a capacitivearray of electrodes or nodes that operate in accordance with amutual-capacitance or self-capacitance scheme. The touch sensors 1103may be integrated with one or more layers of a display stack (e.g., thedisplay 107) to provide the touch-sensing functionality of atouchscreen. The touch sensors 1103 may operate in conjunction with theforce sensors 1105 to generate signals or data in response to touchinputs.

The force sensors 1105 may detect various types of force-based inputsand generate signals or data that are able to be accessed usingprocessor instructions. The force sensors 1105 may use any suitablecomponents and may rely on any suitable phenomena to detect physicalinputs. For example, the force sensors 1105 may be strain-based sensors,piezoelectric-based sensors, piezoresistive-based sensors, capacitivesensors, resistive sensors, or the like. The force sensors 1105 mayinclude any suitable components for detecting force-based inputs andgenerating signals or data that are able to be accessed using processorinstructions, including electrodes (e.g., electrode layers), physicalcomponents (e.g., substrates, spacing layers, structural supports,compressible elements, etc.) processors, circuitry, firmware, and thelike. The force sensors 1105 may be used in conjunction with variousinput mechanisms to detect various types of inputs. For example, theforce sensors 1105 may be used to detect presses or other force inputsthat satisfy a force threshold (which may represent a more forcefulinput than is typical for a standard “touch” input) Like the touchsensors 1103, the force sensors 1105 may be integrated with or otherwiseconfigured to detect force inputs applied to any portion of the device1100. The force sensors 1105 may be integrated with one or more layersof a display stack (e.g., the display 107) to provide force-sensingfunctionality of a touchscreen.

The device 1100 may also include one or more haptic devices 1106. Thehaptic device 1106 may include one or more of a variety of haptictechnologies such as, but not necessarily limited to, rotational hapticdevices, linear actuators, piezoelectric devices, vibration elements,and so on. In general, the haptic device 1106 may be configured toprovide punctuated and distinct feedback to a user of the device. Moreparticularly, the haptic device 1106 may be adapted to produce a knockor tap sensation and/or a vibration sensation. Such haptic outputs maybe provided in response to detection of touch and/or force inputs, andmay be imparted to a user through the exterior surface of the device1100 (e.g., via a glass or other surface that acts as a touch- and/orforce-sensitive display or surface).

The one or more communication channels 1104 may include one or morewireless interface(s) that are adapted to provide communication betweenthe processing unit(s) 1101 and an external device. In general, the oneor more communication channels 1104 may be configured to transmit andreceive data and/or signals that may be interpreted by instructionsexecuted on the processing units 1101. In some cases, the externaldevice is part of an external communication network that is configuredto exchange data with wireless devices. Generally, the wirelessinterface may include, without limitation, radio frequency, optical,acoustic, and/or magnetic signals and may be configured to operate overa wireless interface or protocol. Example wireless interfaces includeradio frequency cellular interfaces, fiber optic interfaces, acousticinterfaces, Bluetooth interfaces, infrared interfaces, USB interfaces,Wi-Fi interfaces, TCP/IP interfaces, network communications interfaces,or any conventional communication interfaces. The communicationschannels 1104 may be configured to use components of the device housing(e.g., the second segments 112) as antennas to send and/or receivewireless communications.

As shown in FIG. 11, the device 1100 may include a battery 1107 that isused to store and provide power to the other components of the device1100. The battery 1107 may be a rechargeable power supply that isconfigured to provide power to the device 1100 while it is being used bythe user.

The device 1100 may also include one or more displays 1108. The displays1108 may use any suitable display technology, including liquid crystaldisplays (LCD), an organic light emitting diodes (OLED), active-matrixorganic light-emitting diode displays (AMOLED), or the like. If thedisplays 1108 use LCD technology, the displays 1108 may also include abacklight component that can be controlled to provide variable levels ofdisplay brightness. If the displays 1108 include OLED or LEDtechnologies, the brightness of the displays 1108 may be controlled bymodifying the electrical signals that are provided to display elements.The displays 1108 may correspond to any of the displays shown ordescribed herein (e.g., the display 107).

The device 1100 may also include one or more additional sensors 1112 toreceive inputs (e.g., from a user or another computer, device, system,network, etc.) or to detect any suitable property or parameter of thedevice, the environment surrounding the device, people or thingsinteracting with the device (or nearby the device), or the like. Forexample, a device may include accelerometers, temperature sensors,position/orientation sensors, biometric sensors (e.g., fingerprintsensors, photoplethysmographs, blood-oxygen sensors, blood sugarsensors, or the like), eye-tracking sensors, retinal scanners, humiditysensors, buttons, switches, lid-closure sensors, or the like.

To the extent that multiple functionalities, operations, and structuresdescribed with reference to FIG. 11 are disclosed as being part of,incorporated into, or performed by the device 1100, it should beunderstood that various embodiments may omit any or all such describedfunctionalities, operations, and structures. Thus, different embodimentsof the device 1100 may have some, none, or all of the variouscapabilities, apparatuses, physical features, modes, and operatingparameters discussed herein.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings. Also, when used herein to referto positions of components, the terms above and below, or theirsynonyms, do not necessarily refer to an absolute position relative toan external reference, but instead refer to the relative position ofcomponents with reference to the figures.

What is claimed is:
 1. An electronic device comprising: a display; acover over the display and defining at least a portion of a frontsurface of the electronic device; and a housing comprising: a firstmetal segment defining a portion of a back surface of the electronicdevice; a second metal segment defining: a first portion of a top sidesurface of the electronic device; and a first portion of a first lateralside surface of the electronic device; a third metal segment defining: asecond portion of the top side surface of the electronic device; and afirst portion of a second lateral side surface of the electronic device;and a molded element formed of a polymer material and positioned betweenthe first metal segment and the second metal segment and between thefirst metal segment and the third metal segment and defining: a secondportion of the first lateral side surface of the electronic device; asecond portion of the second lateral side surface of the electronicdevice; and a third portion of the top side surface of the electronicdevice.
 2. The electronic device of claim 1, wherein the second metalsegment is configured to function as an antenna.
 3. The electronicdevice of claim 2, wherein: the antenna is a first antenna; and thethird metal segment is configured to function as a second antenna. 4.The electronic device of claim 3, wherein: the housing defines a slotextending through the back surface; the slot defines a length of thesecond metal segment; and the length of the second metal segmentcorresponds to a wavelength of a wireless communication frequency of theantenna.
 5. The electronic device of claim 4, wherein: the slot is afirst slot; the wireless communication frequency is a first wirelesscommunication frequency; the housing further defines a second slotextending through the back surface, the second slot having a differentlength than the first slot; the second slot defines a length of thethird metal segment; and the length of the third metal segmentcorresponds to a wavelength of a second wireless communication frequencydifferent from the first wireless communication frequency.
 6. Theelectronic device of claim 1, wherein: the housing is a single piece ofaluminum; the first metal segment and the second metal segment areconnected by a first bridge segment defined by the single piece ofaluminum; and the first metal segment and the third metal segment areconnected by a second bridge segment defined by the single piece ofaluminum.
 7. The electronic device of claim 1, wherein the second metalsegment is longer than the first metal segment.
 8. An electronic devicecomprising: a display; a cover assembly defining at least a portion of afront surface of the electronic device; a touch sensor configured todetect touch inputs applied to the front surface of the electronicdevice; a housing at least partially enclosing the display and the touchsensor and comprising: a first conductive segment defining a portion ofa back surface of the electronic device; a second conductive segmentdefining: a first portion of a first lateral side surface of theelectronic device; and a first portion of a top side surface of theelectronic device; a third conductive segment coupled to the firstconductive segment and defining: a first portion of a second lateralside surface of the electronic device; and a second portion of the topside surface of the electronic device, the second portion of the topside surface longer than the first portion of the top side surface; anda nonconductive molded element positioned in: a first gap definedbetween the first conductive segment and the second conductive segment;and a second gap defined between the first conductive segment and thethird conductive segment; and antenna circuitry coupled to the secondconductive segment.
 9. The electronic device of claim 8, wherein: theportion of the back surface of the electronic device is a first portionof the back surface; and the nonconductive molded element defines asecond portion of the back surface.
 10. The electronic device of claim8, wherein the housing further comprises: a first bridge segmentstructurally and conductively coupling the first conductive segment tothe second conductive segment; and a second bridge segment structurallyand conductively coupling the first conductive segment to the thirdconductive segment.
 11. The electronic device of claim 10, wherein thefirst conductive segment, the second conductive segment, the thirdconductive segment, the first bridge segment, and the second bridgesegment are formed from a single piece of metal.
 12. The electronicdevice of claim 10, wherein: the housing further comprises a fourthconductive segment structurally and conductively coupled to the firstconductive segment by the first bridge segment; the antenna circuitry isfirst antenna circuitry; and the electronic device further comprisessecond antenna circuitry coupled to the fourth conductive segment. 13.The electronic device of claim 8, further comprising: an electricalground coupled to a first location of the second conductive segment; andan antenna feed coupled to a second location of the second conductivesegment.
 14. The electronic device of claim 8, wherein: the antennacircuitry is first antenna circuitry configured to process signalscorresponding to a first wireless communication protocol; and theelectronic device further comprises second antenna circuitry coupled tothe third conductive segment and configured to process signalscorresponding to a second wireless communication protocol different fromthe first wireless communication protocol.
 15. An electronic devicecomprising: a display; a housing member at least partially surroundingthe display and comprising: a first conductive segment defining a firstportion of a back wall of the electronic device; a second conductivesegment configured to function as an antenna and defining: a corner ofthe housing member; a first portion of a first side wall of theelectronic device; and a first portion of a second side wall of theelectronic device, the second side wall joining the first side wall atthe corner of the housing member; and a molded nonconductive elementdefining: a second portion of the back wall of the electronic device; asecond portion of the first side wall of the electronic device; and asecond portion of the second side wall of the electronic device.
 16. Theelectronic device of claim 15, wherein the housing member furtherdefines a bridge segment structurally and conductively coupling thefirst conductive segment to the second conductive segment.
 17. Theelectronic device of claim 16, wherein the first conductive segment, thesecond conductive segment, and the bridge segment are formed from asingle piece of metal.
 18. The electronic device of claim 16, whereinthe molded nonconductive element at least partially encapsulates thebridge segment.
 19. The electronic device of claim 15, wherein theelectronic device further comprises antenna circuitry coupled to thesecond conductive segment and configured to process signalscorresponding to a wireless communication protocol.
 20. The electronicdevice of claim 19, wherein a length of the second conductive segmentcorresponds to a wavelength of the wireless communication protocol.